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The SMTconnect 2024 – Electronics production on the cutting edge
Innovative, compact and efficient: The SMTconnect is the annual industry highlight, at which experts can network, exchange ideas and present their products for the entire spectrum of electronics production under one roof.
WT Microelectronics buys Future Electronics for $3.8bn
April 05, 2024
Taiwan's WT Microelectronics has completed its acquisition of Canada's Future Electronics to create "a global electronic components distribution powerhouse".
Taiwan hit by strongest earthquake in 25 years
April 03, 2024
On Wednesday, Taiwan was hit by a 7.2 magnitude earthquake, the strongest to hit the island in at least 25 years, prompting a tsunami warning for southern Japan and the Philippines, which was later lifted.
IBM bags 10-year $576m US defence contract
March 22, 2024
The US Defense Microelectronics Activity (DMEA) has handed IBM an up-to-10 year USD 576 million contract to consult on the purchase of chips for the military.
ASU and Deca team up to open research center
March 20, 2024
Arizona State University (ASU) and Deca Technologies (Deca), a provider of advanced wafer- and panel-level packaging technology, are teaming up to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
Renesas forms new JV to build OSAT facility in India
March 19, 2024
CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics recently signed an agreement to establish a joint venture to build and operate an OSAT facility in India.
Moov launches EU expansion
March 13, 2024
Moov, a company operating a marketplace for used semiconductor equipment, has hired Eric Tribolet as Director of European Sales, to help the company expand its presence in European markets.
China will set aside $27bn to counter US sanctions
March 11, 2024
Central and local government agencies in China are pouring money into the so-called Big Fund, which was set up to accelerate the development of chip making tech in the country.
NIST orders a scia Coat 200 system from scia Systems
March 07, 2024
scia Systems GmbH, an specialist in advanced ion beam and plasma process equipment for microelectronics, MEMS, and precision optics industries, has received an order for a scia Coat 200 system from US-based National Institute of Standards and Technology (NIST).
India approves first semiconductor fab
March 01, 2024
The Indian government has rubber stamped a $15.2 billion budget to build three new semiconductor plants, including the country's first 12-inch wafer fab.
France's electronics evolution and sustainable future
February 14, 2024
There is currently a lot of movement within the European electronics industry, along with all its sectors, which were key talking points during Evertiq’s inaugural Expo in Sophia Antipolis, France on February 8, 2024.
Switzerland announces three year SwissChips initiative
February 12, 2024
Europe's neutral country has unveiled a new $38m programme to boost research and innovation in semiconductors, microelectronics and IC design.
CG Power leads effort to create Indian OSAT plant
February 12, 2024
Indian industrial giant CG Power and Industrial Solutions is leading a JV with US's Renesas and Thailand's Stars to establish a new Outsourced Semiconductor Assembly and Test (OSAT) facility.
Evertiq Expo Sophia Antipolis is just around the corner
February 07, 2024
Time is drawing close for Evertiq's first-ever Expo on the French Riviera. Evertiq has paid close attention to the ongoing developments in the market and the world at large and organised a program that reflects just that.
WT Group bags $1.9bn loan to proceed with Future buyout
February 06, 2024
Taiwan's WT Group, the fourth-largest semiconductor component distributor in the world, has agreed a five-year syndicated loan project worth US 1.9 billion with two banks.
Applied Materials up fund MIT's nanoscale lab enhancements
February 02, 2024
MIT, Applied Materials and the Northeast Microelectronics Coalition (NEMC) Hub have committed more than USD 40 million to add advanced nano-fabrication equipment and capabilities to the MIT.nano lab.
Imec to build overseas R&D lab in Malaga
February 02, 2024
Belgium's Interuniversity Microelectronics Centre (IMEC) is to open a new research centre in Malaga Spain with the creation of 450 jobs.
Japan earmarks $307m for optical chip R&D centre
February 02, 2024
The Japanese government is making available USD 307 million in subsidies for a new unit to research optical technology semiconductors. The project is backed by NTT, Intel, and SK Hynix.
350+ new Chinese semiconductor industry projects in 2023
February 01, 2024
In a time where we're seeing more and more investments being made to secure technological sovereignty concerning semiconductors – both in terms of innovation and manufacturing – China is making a push strategically fortify itself.
NEOTech expands centre for microelectronics
January 31, 2024
EMS provider NEOTech has expanded its manufacturing centre for Microelectronics in Chatsworth, California, as the need for reliable and complex Micro-E circuits continues to grow.
Intel and UMC to develop 12nm process platform
January 26, 2024
Intel and United Microelectronics Corporation (UMC) will collaborate on a 12-nanometer process to be manufactured at Intel fabs in Arizona from 2027.
AT&S officially confirms $1bn Malaysia IC facility
January 25, 2024
Austria Technologie & Systemtechnik (AT&S) has unveiled a new integrated circuit substrates manufacturing plant in Kedah, Malaysia.
Neways acquires microsystems company Sencio
January 18, 2024
Electronics manufacturer Neways has completed the acquisition of the activities of Sencio, a microsystems company based in Nijmegen, the Netherlands, that specialises in advanced packaging for smart sensing and actuation applications.
Nokia to invest €360M in German hardware and chip design
January 17, 2024
Finnish telecom company Nokia says it plans to invest EUR 360 million in software, hardware and chip design at its Ulm and Nuremberg sites in Germany.
Taiwan launches recruitment drive across Southeast Asia
January 15, 2024
The Taiwanese Ministry of Economic Affairs has revealed a mission to tap into the semiconductor talent pool across the Philippines, Malaysia, Indonesia and Vietnam.
US Department of Defense awards $190m contract to SkyWater
January 15, 2024
The US defense department has agreed a contract with SkyWater Technology and Deca Technologies to expand domestic production of fan-out wafer level packaging (FOWLP) services.
SkyWater looking to enhance production at its Minnesota facility
January 03, 2024
US semiconductor foundry SkyWater Technology, has submitted a full application for Funding through the CHIPS and Science Act to modernise equipment and enhance the production at its Minnesota Facility
Ukraine reveals plan to compete in the semiconductor space
December 20, 2023
The Ukraine government has declared its intention to help local firms manufacture semiconductors at the rate of 50,000 chips a month by 2028.
A*STAR and centrotherm team up on 200mm SiC technology
December 18, 2023
Two Singaporean forms are to develop thermal processes for SIC device fabrication. The partnership combines A*STAR’s 200mm SiC pilot line with centrotherm’s diffusion and annealing tools.
SiC and its impact on Europe
December 11, 2023
There is no denying that SiC will play a pivotal role in the semiconductor landscape in the future and the power device market specifically.
BAE System to modernise microelectronics facility
December 11, 2023
The U.S. Department of Commerce has awarded USD 35 million in initial funding for BAE Systems to modernise the Microelectronics Center (MEC) in Nashua, New Hampshire.
Siemens and Intel to team up to advance factory efficiency
December 06, 2023
Siemens and Intel have signed a memorandum of understanding (MoU) to collaborate on driving digitalisation and sustainability of microelectronics manufacturing.
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